发明名称 FILLER FOR HEAT-CONDUCTIVE THERMOSETTING RESINS
摘要 FM/6-18531/A Filler for heat-conductive thermosetting resins A powder mixture of alumina with fractions of different particle size and external shape, which mixture comprises: (1) 55 to 75 % by volume of spherical .alpha.-alumina, at least 90 % by weight of which has an average particle size of 20 to 120 .mu.m, (2) 35 to 20 % by volume of spherical alumina, at least 90 % by weight of which has an average particle size of 3 to 25 .mu.m, and (3) 10 to 1 % by volume of alumina, at least 90 % by weight of which has a particle size of 1 to 7 .mu.m, the percentages by volume adding up to 100 %. The mixture is suitable for use as filler for synthetic resins, especially for casting resins, from which shaped articles of high thermal conductivity can be produced.
申请公布号 CA2061093(A1) 申请公布日期 1992.08.15
申请号 CA19922061093 申请日期 1992.02.12
申请人 CIBA-GEIGY AG 发明人 BUJARD, PATRICE;SIEBER, WERNER
分类号 C01F7/02;C08K3/22;C08L101/00;H01L23/373;(IPC1-7):C09C1/40;C08K3/10 主分类号 C01F7/02
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