发明名称 COPPER-CLAD LAMINATE OF EPOXY RESIN
摘要 PURPOSE:To prevent copper migration by laminating one or a plurality of prepregs manufactured by applying epoxy varnish for impregnation, laminating a copper foil of roughened face, containing specified zinc on its upper face and/or lower face, clamping the same by metal mirror plates, heating and pressure molding. CONSTITUTION:A copper foil containing 1.0-10.0wt.% of zinc and of 4mu or less roughness of roughened face is used for an epoxy resin copper-clad laminate to enhance the cleaning effect of the surface, of a substrate increase the surface insulation resistance, control the oxidization elution of copper by the action of zinc contained therein and prevent the generation of copper migration. The surface insulation of a substrate surface 2 is upgraded by using the foil of small surface roughness, and the removal of impurities is simple. The absorption volume of water content is reduced by reducing the surface area of the substrate to control the ionization of impurities and prevent the copper migration. Zinc is eluted prior to copper in the water content of the substrate surface.
申请公布号 JPH04224937(A) 申请公布日期 1992.08.14
申请号 JP19900418225 申请日期 1990.12.26
申请人 SUMITOMO BAKELITE CO LTD 发明人 HAYAI CHIYUU;IIDA TAKAHISA
分类号 B29C43/20;B29K63/00;B29K105/06;B29L31/34;B32B15/08;H05K3/38 主分类号 B29C43/20
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