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发明名称
METHOD AND APPARATUS FOR ETCHING SILICON WAFER
摘要
申请公布号
JPH04225231(A)
申请公布日期
1992.08.14
申请号
JP19900406657
申请日期
1990.12.26
申请人
KAWASAKI STEEL CORP
发明人
ENDO TOSHIYA
分类号
H01L21/304;H01L21/306;H01L21/308
主分类号
H01L21/304
代理机构
代理人
主权项
地址
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