| 摘要 |
PURPOSE: To release the waste heat generated by a power transistor on a circuit board at as high a rate as possible on the surface of the circuit board, related to a cooling structure for a power transistor. CONSTITUTION: With a power transistor 4 connected to a circuit board 1, its collector lead 6 is connected to a collector strip 3 on the circuit board. With an insulating material board 8 of high thermal conductivity assigned to the circuit board, the insulating material board extends over a part of the length of the collector strip adjoining the power transistor, while covering the entire collector strip, and a cooling board 9 to which the thermal energy generated in the power transistor is transferred is fixed to the insulating material board. |
