| 摘要 |
PURPOSE:To reduce the time and the cost of a manufacturing process by performing a burn-in operation in a state that a semiconductor divice is not yet completed during its manufacturing process. CONSTITUTION:According to types of semiconductor devices, insulating members 5 or resistance members 6 are laid in prescribed positions at outer leads 4 in order to perform a burn-in operation before the outer leads 4 are cut from support frames 2a, 2b. On the other hand, insulating members 5a and resistance members 6a whose width is narrower than that of the outer leads 4 are constituted so as to be installed side by side in the central direction. |
