Circuit board mfr. by channelling into metallic coating - using laser beam brightness variation in conjunction with orthogonal movements of table under process computer control

摘要

The beam from a laser head (5) mounted on a crossbeam (6) is focused (4) on to the surface of the circuit board (3) laid on an X-Y table (2). A 35-micron thickness of Cu foil on e.g. a laminated glass substrate is coated with photoresist transparent to infrared. The foil is reduced locally to 3-7 microns by computer controlled adjustments of the laser beam intensity and of speed of movement of the table (2) in both horizontal dimensions. ADVANTAGE - High insulation resistance between conductive tracks is achievable even at the high temps. associated with laser beam machining.