| 摘要 |
PURPOSE:To enable an inner copper foil pattern to be laid high in wiring density even if through-holes are provided at a narrower space by a method wherein heat released at the soldering of components is prevented from diffusing. CONSTITUTION:Connection patterns extending in a circumferential direction which connect connection patterns 6 that extend in a radial direction together through the intermediary of thermal lands 7 are formed rectilinear, and the thermal lands 7 are formed nearly square as a whole. |
