| 摘要 |
<p>PURPOSE: To provide an electronic element assembly in which plural heat generating electronic elements can be effectively cooled by a simple and inexpensive cooling device in the assembly of the heat generating electronic elements. CONSTITUTION: An electronic assembly 11 includes substrates in different levels in which plural substrates 13 are respectively provided with heat generating elements (for example, resistance, capacitor, power source device, and VLSI module). A cooling means 33 for applying cooling fluid for cooling the heat generating elements is provided at the center part of this assembly. In a satisfactory execution example, the cooling means includes coaxially arrayed duct members D1-D4 (which are, for example, made of thermoplastic resin), and the duct member includes a vertical chamber part 45 and a flared end part (trumpet-shaped end part) 47. The flared end part is designed so that the cooling fluid can be directed to plural directions according to the necessity of the assembly. A diffusing means 61 (for example, a plate body to which an open hole is added) for applying averaged turbulent fluid through each duct member can be provided.</p> |
