| 摘要 |
PURPOSE:To provide a method of manufacturing a multilayer printed circuit board which improves a laminating step of a copper foil on an inner layer material, improves operability of the foil for a surface layer at the time of associating in the laminating step, and prevents a defect of the surface layer after laminating. CONSTITUTION:In a step of laminating a multilayer printed circuit board formed by causing a copper foil for a surface layer to adhere to the surface of an inner layer material 1 formed with a conductive wiring pattern on a base material through a prepreg 2, superposing an intermediate plate 4 to become a jig on the copper foil for the surface layer, and heating/pressurizing the plate 4 through a mold 5, an electrolytic copper foil 6 previously formed in a predetermined thickness on the plate 4 by an electrolytic copper plating is used as the copper foil for the surface layer, the foil 6 formed on the plate 4 is superposed on the prepreg 2, and the plate 4 is peeled from the foil 6 after heating/- pressurizing through the mold 5. |
