发明名称 Process for making thick multilayers of polyimide
摘要 A polyimide layer having a thickness greater than about 5 microns is formed on a substrate by coating a substrate with a solution of polymer and a solvent of the formula <IMAGE> wherein R1 and R2 are independently a hydrogen, a C1 to C6 alkyl moiety, or a <IMAGE> R5 is a C1 to C6 alkyl moiety; and R3 and R4 are independently hydrogen or a C1 to C6 alkyl moiety, and curing the resulting coated substrate.
申请公布号 US5137751(A) 申请公布日期 1992.08.11
申请号 US19900613153 申请日期 1990.11.13
申请人 AMOCO CORPORATION 发明人 BURGESS, MARVIN J.;FJARE, DOUGLAS E.;NEUHAUS, HERBERT J.;ROGINSKI, ROBERT T.;WARGOWSKI, DAVID A.
分类号 C08J3/09;C09D179/08;G03F7/038;H05K1/00;H05K3/46 主分类号 C08J3/09
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