发明名称 |
Process for making thick multilayers of polyimide |
摘要 |
A polyimide layer having a thickness greater than about 5 microns is formed on a substrate by coating a substrate with a solution of polymer and a solvent of the formula <IMAGE> wherein R1 and R2 are independently a hydrogen, a C1 to C6 alkyl moiety, or a <IMAGE> R5 is a C1 to C6 alkyl moiety; and R3 and R4 are independently hydrogen or a C1 to C6 alkyl moiety, and curing the resulting coated substrate.
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申请公布号 |
US5137751(A) |
申请公布日期 |
1992.08.11 |
申请号 |
US19900613153 |
申请日期 |
1990.11.13 |
申请人 |
AMOCO CORPORATION |
发明人 |
BURGESS, MARVIN J.;FJARE, DOUGLAS E.;NEUHAUS, HERBERT J.;ROGINSKI, ROBERT T.;WARGOWSKI, DAVID A. |
分类号 |
C08J3/09;C09D179/08;G03F7/038;H05K1/00;H05K3/46 |
主分类号 |
C08J3/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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