| 摘要 |
PURPOSE:To mount an IC component on a circuit board with high reliability by efficiently mounting the component integrally formed with a carrier film on the circuit board and simultaneously inspecting a connecting malfunction. CONSTITUTION:An IC component 2 formed integrally with a carrier film 1 is separated by cutting from the film 1 in a state held by a mounting head 7, the component 2 is mounted on a circuit board 3 by the head 7, pressed to be secured as it is, and heated it in the state by an optical beam or a laser light to connect the leads of the components 2 to the electrodes of the board 3. Then, the surface temperature of the leads of the component is sensed by a sensor, and a connecting malfunction is detected. A temperature rise is monitored by sensing the temperature to control to feed it back to a light emission output, and it is precisely heated. Further, the lead in which the malfunction is sensed, is again irradiated with the beam or the light, the lead is pressed and irradiated with the beam or the light, or heating means is pressed to effectively connect the leads of the component. |
