发明名称 |
Hybrid/microwave enclosures and method of making same |
摘要 |
A method of forming enclosures for microwave and hybrid devices and the enclosure itself wherein the metals to be joined are thin (i.e., less than 40 mils thick) and/or thick (up to several inches) and wherein metallurgical hermetic bonds are provided between adjacent metals which are generally difficult to bond to each other and may be bonded by a select number of bonding processes.
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申请公布号 |
US5138114(A) |
申请公布日期 |
1992.08.11 |
申请号 |
US19900413346 |
申请日期 |
1990.09.27 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
BREIT, HENRY F.;HINGORANY, PREMKUMAR R.;HAUG, JOHN A. |
分类号 |
H01L21/50;H01L23/66 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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