CONNECTION OF A SEMICONDUCTOR COMPONENT TO A METAL CARRIER

摘要

A reliable connection of a semiconductor component to a metal carrier is provided which avoids damage during bonding. A buffer material is applied between the semiconductor component and the metal carrier. Means are provided for fixing the buffer material during the bonding, such as a roughening of one or both surfaces in contact with the buffer material. Also, the metal carrier has a stiffening structure. Also, a weakening of the metal carrier can serve to increase the flexibility of the metal carrier and prevent damage thereto during bonding.