| 摘要 |
<p>PURPOSE:To accurately suck an IC by providing the following: a pad which sucks the IC; a ring pipe which is formed to be a ring shape having a size into which a finger can be fitted and which transmits a vacuum state; and a valve which releases the vacuum state in the halfway part of a flexible pipe connecting a vacuum device to the ring pipe. CONSTITUTION:A pad 1 is a sucking disc; a hole which transmits a vacuum is made in its central part; it is connected to a ring pipe 2 which has formed a pipe so as to be in a ring shape. The ring pipe 2 has an inside diameter which can fix a finger at its first joint part when the finger is fitted into the ring; it is connected to the pad 1 and a pipe 3. The pipe 3 is a flexible pipe which connects a vacuum device 5 to the ring pipe 2. A valve 14 is used to release the vacuum state of the pipe 3; it is installed in a position where it can be manipulated by a thumb when the ring pipe 2 is attached to a forefinger.</p> |
