| 摘要 |
PURPOSE:To reduce an irregularity in a plating thickness due to the difference in places at a cathode part by a method wherein a plurality of anodes are provided and circuits connecting the individual anodes to a power-supply device are controlled so as to be turned on and off for an arbitrary time via a timer. CONSTITUTION:For an anode structure, a lead frame 6 for semiconductor devices 5 is put on a plurality of jigs and is connected to a cathode rod 4 and outer leads at the lead frame 6 are electroplated. One central anode 2a out of a plurality of anodes 2 is connected to an independent anode rod 3a, and two other anodes 2b are connected to another anode rod 3b. Circuits from the individual anode rods to a rectifier 9 are independent, and a timer 9 used to control the circuits so as to be turned on and off is situated between the anode rod 3b and the rectifier 8. For example, when a plating operation is executed, the circuit connected to the anode at the end is turned off timely by using the timer 9 and is plated. Then, the plated thickness at the end part can be controlled so as to be low. |
