| 摘要 |
PURPOSE:To comply with a high-density mounting operation when a wiring board is modified. CONSTITUTION:At a wiring board, element connecting pads 2 which are arranged inside an element mounting area on the wiring board and which are connected to vias 1 for inner-layer connection use arranged near them are connected, by using inner patterns 4, to relay pads 3 arranged outside the element mounting area. Disconnection parts which are connected by using an adhesive 6 mixed with anisotropic conductive particles 5 are formed in routes from the element connecting pads 2 to the relay pads 3. The board is modified by heating and pressurizing the anisotropic conductive particles 5. |
