发明名称 METHOD AND APPARATUS FOR INSPECTION OF EXTERNAL VIEW
摘要 <p>PURPOSE:To accurately inspect a wire-bonded state by a method wherein the center at a rise part from a ball at a bonding wire is inspected. CONSTITUTION:A wire-bonded specimen 2 is illuminated in such a way that no shadow is formed at a ball 2a formed at a bonding part; the image of a wire-bonded part is picked up in such a way that the upper part of a rise part 2c from the ball 2a at a bonding wire 2b is out of focus. The central position at the lower part of the rise part 2c is detected and the shape of the ball is extracted. Whether the wire-bonded state is good or not is judged based on the central position and the shape of the ball.</p>
申请公布号 JPH04219952(A) 申请公布日期 1992.08.11
申请号 JP19900404404 申请日期 1990.12.20
申请人 FUJITSU LTD 发明人 OSHIMA YOSHITAKA;TSUKAHARA HIROYUKI;ANDO MORITOSHI
分类号 G01B11/24;H01L21/66 主分类号 G01B11/24
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