发明名称 Apparatus for securing electronic device packages to heat sinks
摘要 An elongated unitary clip apparatus having an S-shaped mid-section connecting end portions which extend in opposite directions from the mid-section is mounted within an aperture in a support base so that one end of the apparatus extends substantially parallel with one face of the support base and the opposite end extends substantially parallel with the opposite face. One end of the clip apparauts is secured in a second aperture in the support base and the opposite end urges an electronic device package into contact with a heat sink.
申请公布号 US5138524(A) 申请公布日期 1992.08.11
申请号 US19910762377 申请日期 1991.09.19
申请人 THERMALLOY INCORPORATED 发明人 SMITHERS, MATTHEW C.
分类号 H01L23/40 主分类号 H01L23/40
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