| 摘要 |
PURPOSE:To provide a method for manufacturing uniformly and stably performing processing of an inner layer circuit board, which is a constituent material in order to stable ensure excellent halo resistance in a multilayer laminate. CONSTITUTION:In a method where adhesiveness between an inner layer circuit board and pre-preg is improved, a copper circuit of the inner layer circuit board is given oxidation treatment, a base metal such as zinc is stuck to the surface of the oxidation-treated copper circuit for being coated, and while the base metal is dissolved by acid and hydrogen in a nascent state generated at this time reduces cupric oxide to cause a halo phenomen into cuprous oxide and a metal copper, the inner circuit board having an appearance of uniform color ton can be stably obtained when sticking of the base metal is performed in the range of a coating amount 1 to 30g/m<2>, while being treated by desirably using a reducing acid treatment liquid having concentration in the range of 1 to 10 mole/liter. |
