PROCEDE ET DISPOSITIF D'INSERTION DE PUCES DANS DES LOGEMENTS D'UN SUBSTRAT PAR FILM INTERMEDIAIRE.

摘要

Process for inserting chips into receptacles made in a substrate in particular of the hybrid type, consisting, before fixing the chips (1a) into the abovementioned receptacles (2a), in retaining the chips (1a) in the abovementioned receptacles (2a) respectively by way of a film (6) which is glued onto one of the faces of the substrate (3) and onto which the chips are glued.