PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING POLYIMIDE FILM PATTERN AND SEMICONDUCTOR DEVICE USING SAME

摘要

PURPOSE:To form the polyimide pattern without using any other photoresist in manufacturing the semiconductor device. CONSTITUTION:This photosensitive resin composition is characterized by comprising a resin component a polyamido acid derivative having repeating units each represented by formula I and a photosensitive agent component containing an o-quinone-diazide compound. In formula I, R<1> is a quaternary organic group; R<2> is a divalent organic group; and each of R<3> and R<4> is a monovalent organic group or hydroxyl group, but at least one of them is an organic group having a hydroxyl group linked to an aromatic ring.