| 摘要 |
PURPOSE:To increase mechanical fixing strength against a substrate for an optical device and enhance reliability by supporting said optical device by way of molding resin with a metal bump. CONSTITUTION:An optical device 2 is mounted on a substrate 1 by way of a bump 3 according to a flip chip bonding process. A first passivation film 5 and a second passivation film 6 are mounted on the optical device 2. After the second passivation film 6 is removed, resin 4 is deposited on the substrate 1 and the optical device 2 where the optical device 2 is molded so that the whole part may be convered on the substrate 1. Then, the resin 4 is removed from above until the first passivation film is exposed. At least, the light receiving of the optical device 2 or the light emitting section 22 is opened on the surface by removing the first passivation film so that the optical device 2 itself may be united and fixed with the substrate by a metal bump 3 and resin 4a and 4b. |
