| 摘要 |
<p>PURPOSE:To realize a package structure of a semiconductor device which is provided with both airtight and electromagnetic shield, small-sized, light-weight, and easy to be sealed by a simple structure. CONSTITUTION:A cap 20 has a flange 22 on its periphery. A circuit board 10 has the following; a first conducting layer 24 formed at the portion on the upper surface which portion corresponds with the above flange, a second conducting layer 28 covering almost the whole part of the lower surface side, and many conducting through holes 30 which are uniformly dispersed just under the first conducting layer and connect the first and the second conducting layers. A semiconductor element 14 is mounted on the upper surface of the circuit board, and the first conducting layer and the flange are sealed with conductive sealing material 32, thereby hermetically sealing and, at the same time, electromagnetically shielding the element.</p> |
