| 摘要 |
PURPOSE:To enhance heat resistance of a multilayer circuit board formed with inner viaholes. CONSTITUTION:A laminating layer material 4 such as a metal foil, etc., is superposed on an inner layer circuit board 2 formed with viaholes 1 through a prepreg 3, heated, pressurized, and multilayer-formed to manufacture a multilayer circuit board. After the viaholes 1 of the board 2 are buried with resin 5, the multilayers are formed. The viaholes 1 are filled with the resin 5, a fear of generating an air gap due to insufficient resin of the prepreg 3 is eliminated and a swell, etc., is not generated at the time of soldering. |
