| 摘要 |
<p>A support for integrated circuits or semiconductor chips consisting of a support substrate in the form of a flexible film (2) having on its surface contact areas (4), conductive tracks and terminals (6) for the semiconductor chip (7) is fitted with a stiffening ring (8) surrounding only a part of the surface of the substrate (2). The material of the stiffening ring is such that its flexural strength is substantially higher than that of the flexible substrate (2). The integrated circuit/s is/are arranged inside the stiffening ring (8) in the form of a semiconductor crystal (7). For the further protection of the semiconductor chip, the inside of the stiffening ring is filled with a potting compound. The fact that the stiffening ring has securing projections (9) pointing radially inwards and substantially uniformly distributed over the inner circumference of the reinforcing ring reduces the danger of the compound separating from the stiffening ring.</p> |
