| 摘要 |
A partially metal plated, moulded electronic component is produced by moulding a primary section of the component in an insulative plastic material, electroless plating to add a catalyst such as gold or palladium after roughing the surface of the component, return to the mould and add a second moulding leaving the desired parts of the first moulding exposed, then finally plating the exposed parts only with a metal coating. The article produced has the catalyst metal plated onto the primary moulding only.
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