发明名称 WASHING OF SEMICONDUCTOR WAFER
摘要 <p>PURPOSE:To markedly reduce percent detective by preventing electrification of a semiconductor pellet and electrostatic breakdown of a semiconductor pellet during the washing step. CONSTITUTION:At least one face of an adhesive tape 7 which holds a semiconductor wafer 1 is coated with a conductive member 8. Charges developed in the adhesive tape 7 by washing the semiconductor wafer 1 are eliminated immediately through the conductive member 8; therefore, there is no elimination through the semiconductor wafer 1, so that no electrostatic breakdown of the semiconductor wafer 1 occurs.</p>
申请公布号 JPH04215434(A) 申请公布日期 1992.08.06
申请号 JP19900402386 申请日期 1990.12.14
申请人 CANON INC 发明人 SATO TOSHIAKI;TABATA MASAMI
分类号 H01L21/304;H01L21/301;H01L21/78 主分类号 H01L21/304
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