| 摘要 |
<p>PURPOSE:To prevent deformation of package leads for connecting the circuit on a chip with an external circuit by providing a package including leads, each of which has a flat portion protruding from a side bottom for surface mounting and has a bent portion inside the package. CONSTITUTION:A chip 1 is fixedly attached to a die stage, and its circuit is connected to leads 2A and 2B through wire 4. The leads 2A and 2B have an offset bend within packages 5A and 5B, and their ends outside the packages are flat for surface mounting. The lead length outside the package is 1/2 to 1/3 of that of the conventional package, and thus the leads have a higher resistance to deformation. In addition, moisture entering between the leads and the package is less liable to reach the chip.</p> |
