| 摘要 |
PURPOSE:To obtain a printed board wherein packaging density is high, manufacturing is easy, and cost is low. CONSTITUTION:In a printed board wherein a wiring circuit using a plurality of conductor patterns is constituted on a board, the following are formed in order by printing; an insulating layer 15 covering the conductor patterns, a conductor layer 16 which is formed on the insulating layer 15 and connects the above conductor patterns 13a, 13b, and a conductor protecting film 17 covering the conductor layer 16. |
