| 摘要 |
PURPOSE:To reduce the temperature rise of a semiconductor element, and realize excellent operation, by mounting a Peltier element on the rear side of an island on which a semiconductor element is mounted, and connecting the Peltier element with leads by using wires. CONSTITUTION:A semiconductor element 3 is mounted on an island 4, and connected with leads 5 by using wires 2. A resin package 6 is formed by using resin. A Peltier element 1 also is mounted on the rear side of the island 4, and connected with the leads 5 by using wires 2p. Many leads 5 are prepared, and the semiconductor element 3 and the Peltier element 1 are connected with separate leads. |
