发明名称 CONNECTING STRUCTURE OF ELECTRONIC CIRCUIT
摘要 PURPOSE:To prevent an increase in connection resistance and disconnection by heat cycles by providing conductive patterns connected to the electrode patterns on a glass substrate and insulating films having electronic circuits for supplying electric signals to the conductive patterns and making insulating plates to adhere having the coefft. of linear expansion equal to the coefft. of linear expansion of the glass substrate on the insulating films in the junctures of the respective patterns. CONSTITUTION:The conductive patterns 6 disposed on the insulating films 4 and the electrode patterns 3 disposed on the glass substrate 2 are connected. The glass substrate 2 and the insulating films 4 are equal in the linear expansion, etc., and, therefore, these films function to suppress the thermal stresses arising from the heat cycles generated by on and off, etc., of a power source device in the junctures between the electrode patterns 6 and the conductive patterns 6 to a lower level.
申请公布号 JPH04216589(A) 申请公布日期 1992.08.06
申请号 JP19900411296 申请日期 1990.12.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 YOSHIOKA KAZUO
分类号 G02F1/1345;G09F9/00;H01L21/60;H01L23/498;H05K1/02;H05K1/14;H05K1/18;H05K3/36 主分类号 G02F1/1345
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