| 摘要 |
PURPOSE:To enhance heat resistance of a multilayer circuit board formed with inner viaholes. CONSTITUTION:A laminating layer material 4 is superposed on an inner layer circuit board 2 formed with viaholes 1 through a plurality of prepregs 3, heated, pressurized, and multilayer-formed to manufacture a multilayer circuit board. As prepreg 3a to be so disposed as to be brought into contact with the board 2 of the plurality of prepregs 3, a prepreg having higher resin contact than that of other prepreg 3b and lower melting viscosity of the immersed resin than that of the other prepreg 3b is used. A large quantity of resin is supplied from the prepreg 3a in contact with the board 2 to the viaholes 1, the resin having low melting viscosity is easily fed to flow into the viaholes 1, thereby preventing generation of an air gap in the viaholes 1. |
