| 摘要 |
PURPOSE:To accurately measure the misregistration of a wafer by a simple method which occurs in a wafer process in semiconductor device manufacturing processes. CONSTITUTION:After a layer 30 is formed on a semiconductor substrate in the first pattern and resistance layers 321-323 are formed at the overlapping sections of the layer 30 with the second patterns 311-313 by positioning the patterns 311-313 to the layer 30, the misregistration between the first and second patterns is found by measuring the resistance of each resistance layer 321-323. At the time of finding the positional deviation, each measured resistance value is fitted to a logical function (33) about the positions of the resistance layers 321-323 and the positional deviation is found from the misregistration of the layers 321-323 from the central axis 34 of the function 33. |
