| 摘要 |
PURPOSE:To mount a semiconductor chip on both sides of a die pad by retaining a lead frame in a hollow gap. CONSTITUTION:A first die pad 11 for mounting a first semiconductor chip 31, a second die pad 12 which is arranged inside the first die pad and mounts a second semiconductor chip 32, and a bridge 13 for connecting the pads 11, 12 are provided. By forming a slant on the bridge 13, a height difference is made between the first die pad and the second die pad. Thereby a hollow gap is obtained between the first die pad and the second die pad.
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