发明名称 HIGH-DENSITY INTERCONNECTION
摘要 <p>PURPOSE: To provide the quantity of producing exceeding a high-density hybrid assembly, formed from a round bump by mutually orthogonally putting bumps in order, fusing bump surfaces and increasing bump surface areas after the bumps have been fused. CONSTITUTION: Bottom and upper mutual connecting bumps 12 and 14 are orthogonally put in order before being fused under pressure due to mixed integration, the bumps 12 and 14 are fused and applied so as to form a hybrid assembly, and the surface area of a mutual connection 10 is increased after the bumps 12 and 14 are fused together. The bumps 12 and 14 are metals and have a rectangular form, the length of the respective bumps 12 and 14 or its longest dimensional L is set almost at a level of 10-20 micrometers typically or shorter than it, and width W of the bumps 12 and 14 is set almost at the level of 2-4 micrometers.</p>
申请公布号 JPH04216639(A) 申请公布日期 1992.08.06
申请号 JP19910059584 申请日期 1991.02.28
申请人 HUGHES AIRCRAFT CO 发明人 JIEEMUSU ERU GEITSU
分类号 H01L21/60;H01L21/603;H01L23/498;H05K3/34 主分类号 H01L21/60
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