发明名称 FILM STRUCTURE AND ITS MANUFACTURE
摘要 PURPOSE:To offer a film structure easily formable with the film of the objective material having a thermal expansion coefficient different from that of a substrate as for the film structure of the substrate and its manufacturing method. CONSTITUTION:In a film structure in which the film of the objective material having a thermal expansion coefficient different from that of a substrate is formed on the substrate, a primary intermediate layer of a material having ductility higher than that of the material of the substrate is interposed between the substrate and the film.
申请公布号 JPH04214850(A) 申请公布日期 1992.08.05
申请号 JP19900402360 申请日期 1990.12.14
申请人 FUJITSU LTD 发明人 TEJIMA AKITOMO;KURIHARA KAZUAKI;SASAKI KENICHI;KAWARADA MOTONOBU;SATO TAKEHIKO
分类号 C23C4/12;C23C16/00;C23C16/27 主分类号 C23C4/12
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