发明名称 |
FILM STRUCTURE AND ITS MANUFACTURE |
摘要 |
PURPOSE:To offer a film structure easily formable with the film of the objective material having a thermal expansion coefficient different from that of a substrate as for the film structure of the substrate and its manufacturing method. CONSTITUTION:In a film structure in which the film of the objective material having a thermal expansion coefficient different from that of a substrate is formed on the substrate, a primary intermediate layer of a material having ductility higher than that of the material of the substrate is interposed between the substrate and the film. |
申请公布号 |
JPH04214850(A) |
申请公布日期 |
1992.08.05 |
申请号 |
JP19900402360 |
申请日期 |
1990.12.14 |
申请人 |
FUJITSU LTD |
发明人 |
TEJIMA AKITOMO;KURIHARA KAZUAKI;SASAKI KENICHI;KAWARADA MOTONOBU;SATO TAKEHIKO |
分类号 |
C23C4/12;C23C16/00;C23C16/27 |
主分类号 |
C23C4/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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