Metal heat sink baseplate for a resin-encapsulated semiconductor device, having raised portions for welding ground connection wires thereon.

摘要

A metal heat sink baseplate (3) of a resin-encapsulated semiconductor power device, onto which the semiconductor dice (1) is bonded, is provided with one or more raised portions (12) hear the perimeter of the bond area of the semiconductor dice, onto which ground wires (11) may be welded in order to increase the reliability of wire connections realized between ground connection pads (15) and the metallic heat sink baseplate itself. The raised portions are preferably obtained by deep drawing the metal of the baseplate. A Single-In-Line device is shown wherein the deep drawing of the metal heat sink baseplate for realizing a ridge on the assembly face, to be used for realizing wire ground connections, is formed in a separation zone between a portion (4) of the metallic baseplate which extends beyond the perimeter of the encapsulating resin body and onto which the fastening means of an external heat sink are arranged, and the remaining part of the baseplate onto which the semiconductor dice is bonded. The deep drawing performed in this zone is also instrumental in providing a mechanical decoupling between the two portions of the metallic baseplate for reducing transmission of flection stresses.