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发明名称
PRELIMINARY SOLDERING METHOD OF FLAT PACKAGE
摘要
申请公布号
JPH04214657(A)
申请公布日期
1992.08.05
申请号
JP19900401509
申请日期
1990.12.12
申请人
FUJITSU LTD
发明人
TSUJIMURA TAKEHISA
分类号
B23K1/00;B23K1/20;H01L23/50;H05K3/34
主分类号
B23K1/00
代理机构
代理人
主权项
地址
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