| 摘要 |
<p>In a control apparatus for controlling or changing an adhesive force of an adhesive agent (25) decreasingly a workpiece (17) comprising a semiconductor wafer (27) adhered through an adhesive agent (25) to a substrate (26) is charged into a container (6) having a light transmission window (33) and a closure member (32) and the air in the closed chamber thus formed is removed by a deoxygenating means (35) and under this oxygen free condition the photo-setting adhesive agent (25) is irradiated in the closed container (6) by a light, so that the adhesive force of the adhesive agent (25) is weakened in a moment or a very short time, and the time for manufacturing a semiconductor can be shortened and the productivity thereof can be improved. It is of further advantage that a cassette casing (18) containing plural workpieces (17), a charging conveyor (13) and a charging arm (21) are provided on one side of the container (6), and a discharging arm (22) for taking out the workpiece (17) from the container (6), a discharging conveyor (14) and an empty cassette casing (18) are provided on the other side thereof, so that the treatment for weakening the adhesive force of the adhesive agent (25) of the workpiece (17) can be carried out automatically at a high efficiency.</p> |
