| 摘要 |
<p>A process for maintaining the level of cyanide ion stabilizer in an electroless copper plating bath held at a constant predetermined temperature by making additions of predetermined amounts of cyanide ion feedstock at predetermined time intervals. The properties of the copper layer deposited on a substrate by means of the system are significantly improved in uniformity and structural strength. In addition, the plating rate and stability of the bath are far more uniform. A programmable computer system for controlling the process of the invention is also described. <IMAGE></p> |
