发明名称 |
SEMICONDUCTOR DEVICE PROVIDED WITH SUPPORT BODY, MANUFACTURE OF SAID SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: To easily and inexpensively perform the fixture and electric contact of a semiconductor device into a supporter. CONSTITUTION: The semiconductor device has a supporter 1 provided with a groove 2 having walls 3 and 4, on which conductors 6 and 7 extend onto this supporter 1, and a semiconductor device existing in this groove in electrical contact with the conductors on the walls. Thus, a semiconductor device 11 is clamped into a groove 2 and electrically contacted with the conductors 6 and 7 on the walls 3 and 4. Since the semiconductor device 11 is clamped and held between the walls 3 and 4, both the mechanical and electric connections can be easily provided between the semiconductor device 11 and the supporter 1 through only a single process. |
申请公布号 |
JPH04212431(A) |
申请公布日期 |
1992.08.04 |
申请号 |
JP19910021494 |
申请日期 |
1991.01.23 |
申请人 |
PHILIPS GLOEILAMPENFAB:NV |
发明人 |
YOHANESU MARIA KORUNERISU FUERUSUPEEKU;HENDORIKUSU ADORIANUSU RUISU RAARUHOOFUEN;PETERU UIRUHERUMUSU MARIA FUAN DE WAATERU;YAN FUAN MIDENDORUPU;KOONERISU BOUURU |
分类号 |
H01L21/60;H01L23/13;H01L23/498;H01S5/02;H01S5/022;H01S5/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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