| 摘要 |
<p>PURPOSE:To enable semiconductor device trays to be lessened in types by a method wherein holes are regularly bored in a board, and pins are inserted into the holes concerned in a detachable manner. CONSTITUTION:Pins 4 are inserted into holes bored in a board 3 in a detachable manner, and a semiconductor device 1 is housed in a region surrounded with the pins 4. The holes of a few types are previously bored in the board 3 in a regular arrangement corresponding to the size and the shape of the semiconductor device 1. When the semiconductor device 1 is changed in size and shape, some of the pins 4 are pulled out and inserted into the non-occupied holes corresponding to the size and the shape of the semiconductor device 1 to house it. By this setup, as a semiconductor device tray can deal with the change of the semiconductor device 1 in size and shape by pulling pins out of holes and inserting them into other holes, it can be lessened in types.</p> |
