| 摘要 |
<p>PURPOSE:To omit the waste of materials and to reduce the cost of the materials by a method wherein in busbar wiring boards, which are respectively provided with a plurality of busbars having a desired pattern and provided on an insulating substrate, the plurality of the busbars are formed by punching selectively from more than two kinds of the conductive metal plates, whose conductivities are different from each other. CONSTITUTION:First layer and second layer busbar wiring boards 101 and 102 are respectively provided with a plurality of busbars 12, which respectively have a tab 13 and are provided on an insulating substrate 11. These busbars 12 are formed by punching from three kinds of materials (a), (b) and (c), whose conductivities are 30%, 65% and 85% and are different from each other. In such a way, by changing the punching materials for the busbars according to the value of a conducting current, the waste of the materials is omitted and the improvement of the punching processability of the busbars can be contrived along with a reduction in the cost of the materials.</p> |
