RESIN CUTTING METHOD AND DEVICE FOR RESIN SEALED SEMICONDUCTOR ELEMENT,申请号JP19900401197-传众专利搜索

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发明名称	RESIN CUTTING METHOD AND DEVICE FOR RESIN SEALED SEMICONDUCTOR ELEMENT
摘要
申请公布号	JPH04213841(A)	申请公布日期	1992.08.04
申请号	JP19900401197	申请日期	1990.12.11
申请人	FUJI ELECTRIC CO LTD	发明人	FURUHATA MITSUO
分类号	H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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