发明名称 Multi-layered wiring structure
摘要 A multi-layered wiring structure includes a plurality of signal lines formed in a common layer and a shield line provided between any two of the lines in a separate layer, with an insulation layer being interposed, for absorbing electrical effects that will occur between the two signal lines. Also, a multi-layered wiring structure includes a plurality of thin-film transistors formed in a common layer and a shield line provided between the source electrode of one such thin-film transistor and the drain electrode of an adjacent thin-film transistor in a separate layer, with an insulation layer being interposed, for absorbing electrical effects that will occur between the source electrode of the one thin-film transistor and the drain electrode of the adjacent thin-film transistor.
申请公布号 US5136358(A) 申请公布日期 1992.08.04
申请号 US19910710791 申请日期 1991.06.05
申请人 FUJI XEROX CO., LTD. 发明人 SAKAI, KAZUHIRO;MIYAKE, HIROYUKI
分类号 H01L23/52;H01L21/3205;H01L23/482;H01L23/522;H01L23/528;H01L27/146;H01L29/78;H01L29/786 主分类号 H01L23/52
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