发明名称 |
Thermocompression bonding in integrated circuit packaging |
摘要 |
A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.mm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.
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申请公布号 |
US5135155(A) |
申请公布日期 |
1992.08.04 |
申请号 |
US19910664359 |
申请日期 |
1991.03.04 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KANG, SUNG K.;PALMER, MICHAEL J.;REILEY, TIMOTHY C.;TOPA, ROBERT D. |
分类号 |
B23K20/02;B23K20/233;B23K33/00;H01L21/603 |
主分类号 |
B23K20/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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