| 摘要 |
PURPOSE:To facilitate the exchange of parts like surface mount elements in a microwave integrated circuit. CONSTITUTION:A dielectric subsubstrate 3 is stacked on a main dielectric substrate 2, and detachably fixed. A part having a surface mount element 6 of a high frequency circuit constituted of both substrates 2, 3 is formed on the substrate 3. I/O terminals 9a, 95, 9c, 9d between the circuits on both substrates 2, 3 are formed on the overlapping surfaces of both substrates 2, 3, both of which I/O terminals are compression-bonded. By this compression-bonding, the circuits on both substrates 2, 3 are combined. On the side surface facing part of the substrates 2, 3, both of the I/O terminals mentioned above are formed by using parallel strip lines having a specified width interval, whose parallel length is made equal to quarter-wavelength in the above high frequency circuit. This facing part turns to a distributed coupling type directional coupler, and both circuits are coupled. A circuit part in which failures are apt to be generated is formed on the dielectric subsubstrate 3, and it is detached and exchanged for new one when a failure has happened. |
