发明名称 |
PRODUCTION OF ELECTRODE WIRING OF MULTIPLAYERED METAL FILM |
摘要 |
<p>PURPOSE:To prevent the occurrence of trouble such as a leakage current of a thin film transistor by removing the overhang of the upper metal layer of a gate electrode made of a multilayered metal film by re-etching. CONSTITUTION:The overhang of the upper metal layer 120b of a multilayered metal film circuit 12 formed at the time of etching the lower metal layer 120a is removed by re-etching and the sides of the upper and lower metal layers are aligned. Since bubbles are not confined, a film formed later such as a gate insulating film formed by plasma CVD or an operative semiconductive layer is made free from abnormality and the occurrence of trouble such as a leakage current of a thin film transistor can be prevented.</p> |
申请公布号 |
JPH04213427(A) |
申请公布日期 |
1992.08.04 |
申请号 |
JP19900401242 |
申请日期 |
1990.12.11 |
申请人 |
FUJITSU LTD |
发明人 |
SOEDA SHINICHI;WATABE JUNICHI;NAKAMURA TAKEHIRO;NASU YASUHIRO;HOSHINO ATSUYUKI |
分类号 |
G02F1/133;G02F1/1343;G02F1/136;G02F1/1368;G09F9/30;H01L21/3205;H01L27/12;H01L29/78;H01L29/786 |
主分类号 |
G02F1/133 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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