| 摘要 |
A compact hybrid laser and photodetector device is disclosed. A heat sink and a metal layer are bonded together, and then mounted on a circuit board. A semiconductor laser chip is mounted on the metal layer. The edge of the metal layer serves as a bonding pad for a wire connection to a bonding pad on the circuit board. A rear-facet photodetector is mounted on the circuit board beneath the semiconductor laser chip. A multiple element photodetector is also mounted on the circuit board for detecting a signal reflected off a media. Preferably, the rear facet and multiple element photodetectors are a single integrated circuit.
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