| 摘要 |
PURPOSE: To provide a package electronic element in which the size of the terminal area of an element with a bonding pad among package lead is made fine, and the outside lead is made rigid. CONSTITUTION: A lead frame 16 of a package electronic element 10 is composed of plural layers 18 and 28, the fine connection with a plurality of bonding pads on an electronic part such as an IC can be attained, and an outside package lead is made rigid. The first lead frame layer 18 is provided with a top end 22 in a fine size for connection with a bonding pad 14 of the IC. The second lead frame layer 28 is overlapped on the first lead frame layer, and this is not provided with a top end. The part of the overlapped double outside lead 16 attached to a print circuit board 32 is made rigid, and the part to be bonded to an electronic part 12 is made fine. Also, thickness, conductivity, and solder adhesiveness can be changed. |
